Fraunhofer Institute for Reliability and Microintegration (IZM), Germany, Research (RES)

Dipl.-Ing. Harald Pötter
Fraunhofer-Institut fuer Zuverlaessigkeit und Mikrointegration (IZM)
Gustav-Meyer-Allee 25, 13355 Berlin, Germany

Phone: +49 30 464 03 136
E-Mail: Harald.Poetter@izm.fraunhofer.de
http://www.izm.fraunhofer.de

Description and expertise of the organisation:
Fraunhofer Institute for Reliability and Microintegration (IZM) -
"Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V." is one of the leading non‐profit organisations of applied research in Europe, undertaking contract research on behalf of industry, the service sector and the government. At present, the organisation maintains more than 80 research units, including 57 Fraunhofer Institutes in Germany. A staff of some 15,000, the majority of whom are qualified scientists and engineers, generate the annual research volume of about 1.4 billion Euros. Of this amount, more than one billion Euros is generated through contract research.

With more than 260 employees, Fraunhofer Institute for Reliability and Microintegration (IZM) is one of the leading institutes in the field of microelectronics and microsystem packaging worldwide. The institute covers all the competencies needed for advanced packaging concepts such as packaging material science and characterization, package design and simulation, high density interconnect and wafer level packaging, chip and board interconnection technologies, 3D‐packaging and vertical chip integration, reliability and failure analysis. The transfer of research results to the industry (small, medium and large enterprises) and the development of custom‐specific solutions for microelectronic packaging and system integration is one of the main tasks of the institute. Fraunhofer IZM operates 2 cleanrooms, a flip chip line and specific labs for material characterization and reliability assessment.

Fraunhofer IZM successfully collaborates with the Research Center of Microperipheric Technologies of Technical University Berlin within The Berlin Center of Advanced Packaging (BeCAP). The Research Center of Microperipheric Technologies focus is on technology oriented basic research, whereas Fraunhofer IZM concentrates on application oriented research and development.


Research interests / Project ideas
Silicon Photonics
3D System Integration
Large Area Electronics
MEMS Packaging
Micro Reliability and Lifetime Estimation
Photonic Packaging
RF & Wireless
Thermal Management
Wafer Level Packaging
Sustainable Technical Development

Keywords
Substrate Integration Technologies
Wafer Level Integration Technologies
Materials, Reliability and Sustainable Development
System Design

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